The Advanced Energy Centre (AEC) at MaRS Discovery District and BSD-TEDA – a joint venture between the Beijing Science Park Development (BSD) and the Tianjin Economic Development Area (TEDA) – are pleased to announce the signing of a Memorandum of Understanding to strengthen their working relationship and to jointly explore potential deployment opportunities for Canada’s advanced energy technologies.

The Memorandum of Understanding was formalized at a signing ceremony in Tianjin attended Mr. Guy Saint-Jacques, the Canadian Ambassador to China, and senior representatives of all parties. In particular, the agreement seeks to identify Canadian technologies for deployment in Tianjin’s new Sino-Canadian Low-Carbon Eco-District, a unique Canadian-Chinese collaboration supported by both the Chinese and the Canadian federal governments.

TianjinMOU_NewsRelease
Mr. Guy Saint-Jacques, the Canadian Ambassador to China, and senior representatives of all parties at the signing ceremony in Tianjin on June 25, 2015.

“The introduction of advanced energy innovation in the Eco-City development will demonstrate the potential of these technologies and provide a platform to expose them directly to the Chinese market” said Ron Dizy, Managing Director of the Advanced Energy Centre.

Read the press release.

 


 

About BSD-TEDA

BSD-TEDA is a joint venture between the Beijing Science Park Development Group and Tianjin TEDA Investment Holdings created to promote the construction, development, investment and operation of the Sino-Canadian Low-Carbon Eco-District, a Canadian-Chinese cooperation project supported by the Chinese Ministry of Housing and Urban-Rural Development and Natural Resources Canada.

Ian Philp

Ian led the development of programs that catalyze export opportunities for Canadian small- and medium-sized energy technology companies. Previously, Ian worked with a boutique investment bank focused on energy efficiency investments, and as an international trade lawyer defending Canada’s renewable energy feed-in tariff program. See more…